JPH022546Y2 - - Google Patents

Info

Publication number
JPH022546Y2
JPH022546Y2 JP9637484U JP9637484U JPH022546Y2 JP H022546 Y2 JPH022546 Y2 JP H022546Y2 JP 9637484 U JP9637484 U JP 9637484U JP 9637484 U JP9637484 U JP 9637484U JP H022546 Y2 JPH022546 Y2 JP H022546Y2
Authority
JP
Japan
Prior art keywords
conductive paste
paste
pellet
syringe
cylindrical body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9637484U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6112569U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9637484U priority Critical patent/JPS6112569U/ja
Publication of JPS6112569U publication Critical patent/JPS6112569U/ja
Application granted granted Critical
Publication of JPH022546Y2 publication Critical patent/JPH022546Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP9637484U 1984-06-26 1984-06-26 導電ペ−スト供給装置 Granted JPS6112569U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9637484U JPS6112569U (ja) 1984-06-26 1984-06-26 導電ペ−スト供給装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9637484U JPS6112569U (ja) 1984-06-26 1984-06-26 導電ペ−スト供給装置

Publications (2)

Publication Number Publication Date
JPS6112569U JPS6112569U (ja) 1986-01-24
JPH022546Y2 true JPH022546Y2 (en]) 1990-01-22

Family

ID=30655819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9637484U Granted JPS6112569U (ja) 1984-06-26 1984-06-26 導電ペ−スト供給装置

Country Status (1)

Country Link
JP (1) JPS6112569U (en])

Also Published As

Publication number Publication date
JPS6112569U (ja) 1986-01-24

Similar Documents

Publication Publication Date Title
US5373984A (en) Reflow process for mixed technology on a printed wiring board
US5829668A (en) Method for forming solder bumps on bond pads
JPH022546Y2 (en])
JPH0419908B2 (en])
JP3496642B2 (ja) ボンディングペーストの転写装置および転写ピンならびにボンディングペーストの転写方法
JPH06168982A (ja) フリップチップ実装構造
JP4045517B2 (ja) フラックス転写装置
JPH027466Y2 (en])
JPS61268372A (ja) 塗布剤移載供給装置
JPH063833B2 (ja) 自動フイン付け装置
JPH0123779Y2 (en])
JP2882091B2 (ja) チップの樹脂封止装置
JP2551053B2 (ja) 半田供給用フィルムおよびその製造方法
JPS58143865A (ja) 塗布装置
KR100197858B1 (ko) 리드 프레임에 스크린 프린트 기법을 이용한 개선된 칩 부착방법
JPH03238834A (ja) ペースト塗布方法およびその装置
JPH06206031A (ja) 粘性体塗布装置およびその方法
JP2001250845A (ja) 半導体チップ実装方法及び実装装置
JP3417243B2 (ja) ボンドの塗布方法
JP3158399B2 (ja) 樹脂塗布方法
KR100235494B1 (ko) 접착제 분사장치 및 다이픽업 장치를 구비하는 다이본딩 시스템
JPH06154679A (ja) 接着剤の転写方法及び該方法に使用する転写装置
JP2000216199A (ja) 異方性導電ペ―ストを用いた電子部品の接続方法およびそのためのコレット
JPH0793336B2 (ja) ダイボンダーにおけるペースト塗布装置
JPS63229166A (ja) 樹脂塗布装置